Printing of the circuitry is done Roll-to-roll on a 60 cm web-width at a resolution of 50 micron line width and spacing.  The tool is very flexible and capable of printing complex multilayer circuits. 
Next to that a pick and place system is available that can assemble large (cm wide) as well as small (0201) components on the foil. For curing of the interconnect materials unique processes are developed that are IP protected. The equipment is placed in a ISO 8 cleanroom to enable production of printed electronics in automotive and medical market segment.