Biografie

Nihesh Mohan completed his Bachelor in Technology (2017) and Master in Science (2020) in the field of Metallurgical and Materials Science from National Institute of Technology, Durgapur and RWTH Aachen respectively. Before joining THI, he also gained practical experience in his field by working at ABB Switzerland as an intern and at Mercedes Benz AG as master thesis student. Currently, he works as a Research Associate at Institute of Innovative Mobility at THI in the research group 'Microelectronic packaging ' under supervision of Prof. Dr. Gordon Elger. His research focuses on printed electronics involving development of Cu particle free inks, process optimization of different printing technologies and fluxfree soldering. His expertise includes material characterization, XRD analysis, sintering, resistance spot welding and powder metallurgy.