Lightweight Electronics by Injection Moulding in Seamless Architecture
02.03.2023 von 14:20 - 14:40
ICM Saal 13a
Vortragsart: Oral Presentation
The present work focuses on the development of technologies (IMD, IML, IME and HPF), demonstrators and prototypes of two central console components (armrest and L-Shape) that comprise the LEIMSA project (www.leimsa.pt). These seamless components allow the incorporation of printed capacitive buttons and sliders with haptic feedback to control different functions in the interior of the car.