Zur Programmübersicht


Lightweight Electronics by Injection Moulding in Seamless Architecture

02.03.2023 von 14:20 - 14:40

ICM Saal 13a

Sprache: Englisch

Vortragsart: Oral Presentation


The present work focuses on the development of technologies (IMD, IML, IME and HPF), demonstrators and prototypes of two central console components (armrest and L-Shape) that comprise the LEIMSA project (www.leimsa.pt). These seamless components allow the incorporation of printed capacitive buttons and sliders with haptic feedback to control different functions in the interior of the car.