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Through-polymer-vias for electrical interconnection between multiple layers in printed electronics

02.03.2023 von 16:20 - 16:40

ICM Saal 14a

Sprache: Englisch

Vortragsart: Oral Presentation


We have shown a method of creating through-polymer-vias (TPVs) with the potential to become a standard in the printed electronics manufacturing processes for making the electrical interconnection between the multiple stacked layers; the TPV opening is created using LASER ablation and the TPV is filled using stencil printing of a conductive paste.