Through-polymer-vias for electrical interconnection between multiple layers in printed electronics
02.03.2023 von 16:20 - 16:40
ICM Saal 14a
Vortragsart: Oral Presentation
We have shown a method of creating through-polymer-vias (TPVs) with the potential to become a standard in the printed electronics manufacturing processes for making the electrical interconnection between the multiple stacked layers; the TPV opening is created using LASER ablation and the TPV is filled using stencil printing of a conductive paste.