The Technical Conference provides status updates on the development of specific products and business sectors. It is industry and application oriented and promotes the ongoing development of products and business segments.
Technical challenges of combining film-based electronics with discrete components for IoT applications. Topics include printed electronic components and systems, including interconnection technologies and integration methods, hybrid integration and sensing, and applications.
Materials and technologies for emerging flexible display applications, including novel emitters (OLED, QDs, perovskites, microLEDs), novel manufacturing routes, additional in-display functionality, and integration challenges in IoT, smart phone displays, TV screens and automotive displays.
Recent advancements and use cases on how printed, hybrid and structural electronics enables unique touch, gesture and haptic trends in human-machine interactions by creating smart, interactive surfaces in applications like automotive, home appliance, medical and others.
Recent progress and use cases on application of printed and flexible electronics for implementing wearable sensors and enabling advanced features in smart garment and wearable devices.
Technologies for energy production, harvesting and storage, including thin-film photovoltaics (Organic solar cells, perovskites, CIGS (copper indium gallium selenide) and DSSC (dye-sensitized solar cell), thermoelectrics, thin-film batteries and supercapacitors.
Challenges and advances in upscaling production, additive (e.g. printing) and heterogeneous manufacturing processes, including materials & processing issues, manufacturing reliability, inspection and quality control in production lines.
Challenges and use cases of large area, printed or organic electronics in biomedical applications. This includes all applications in biomedical and healthcare such as sensors, diagnostic devices and wearable health patches that contain significant printed and flexible elements.
The “functional materials” session covers any novel material that can be used to create flexible electronics and functional surface applications. This entails latest enabling material solutions applicable to multiple types of surfaces, which provide unique features to allow simple surfaces to become smart as well as latest materials that are used to create or protect the surface itself.
Next Generation Flexible Substrates and Encapsulation Materials and Technologies.
Printed electronics processes, materials or/and products which highlight the contribution of our industry to the challenges of circular economy or define milestones by new green products, system concepts and business models.
This session covers the technologies and applications of (flexible) large-area lighting. We encourage the submission of original papers on all aspects of OLED and microLED research, engineering, evaluation and integration for future lighting applications.
Integration of electronics and other multi-physical functions onto structural elements e.g. via 3D printing, laser structuring, in-molding, thermoforming, or 3D MID and its application in mobile electronics, automotive, aerospace, medical devices, sensors and connectors, household appliances, wearables and clothing.
Challenges and advances in materials and integration of various functionalities in textiles. Topics include the interconnection between soft and hard components, advantages of textiles over other transfer media and use cases in close to body scenarios.
Dr. Richard Price, PragmatIC Semiconductor Ltd. (UK), CTO
In addition to the oral presentations, we will also offer a poster exhibition. This means that instead of giving a presentation, you can display the essential information on an A0 poster on both days of the exhibition. During the Poster Session on Wednesday, March 1, 2023 from 18:00 to 19:30, you can communicate with the event participants personally and answer any questions on the spot.