LOPEC takes place at the ICM—Internationales Congress Center München and in Hall B0. Our fairgrounds map and hall plan will help you find your way.
One of LOPEC's biggest strengths is that it really gives participants the chance to find out about every single aspect of the printed electronics industry. We cover the full value chain, from research and development to mass production, including applications and business models.
Exhibitors showcase materials, processes, systems, components, applications and services. Obtain a comprehensive overview of the industry and its products. Participating in LOPEC is worthwhile.
Printed electronics uses numerous organic and inorganic functional materials that can feature a number of characteristics, including (semi)conductivity, electroluminosity, electrochromism and electrophoresis. The value of substrates (adapted to suit a range of applications) is growing, as is the importance of encapsulation materials, which wide the lifespan of applications.
1.5. Encapsulation materials, resins and adhesives
1.6. Other materials
The range of possible materials and applications is vast and this diversity is also reflected in the various technologies used to produce them. Mass printing processes, both analog and digital, are being applied. However, ink-jet printing and coating techniques are also being increasingly used.
2.1. Mass patterning techniques
2.2. Digital printing
2.3. Other printing processes
2.4. Vacuum processes
2.6. Laser processes
2.7. Coating technologies
2.8. Material processing
2.9. Light induced processing
2.10. Dosing and mixing technologies
2.12. Clean room technology
2.13. Roll-to-roll processing
2.14. Other manufacturing processes
Well-engineered packaging is essential for device integration. This process makes use of both specific technologies and those known from conventional electronics. Hybrid systems, which combine the benefits of printed electronics and their more conventional counterparts, are becoming increasingly important here.
3.1. Electronics assembly and packaging
3.3. Electronics assembly and packaging, system integration
3.4. Hybrid systems (polytronics)
In order to ensure product quality, precise and reliable testing and inspection systems are required that guarantee reliable results, even at high throughput rates. It is fairly common for new materials to require completely new testing systems to meet the increased requirements.
4.1. Electrical characterization
4.2. Physical/optical characterization
4.3. Chemical characterization
4.4. Simulation/circuit optimization
4.5. Lifetime testing
4.6. Quality/process control
4.7. Environmental testing
4.8. Other inspection and test systems
The majority of conventional electronic components have now been adapted for use with printed electronic; some are now even being mass produced (e.g., OLED displays). These core elements are essential for complex systems.
5.3. Passive components
5.4. Integrated circuits
5.6. Photovoltaic cells
5.8. Memory elements
5.11. Components for hybrid systems
5.12. Other devices
Technical progress means that printed basic devices are now being integrated into increasingly complex systems. This allows existing applications to be optimized and completely new applications, e.g., smart textiles, to be developed.
6.1. TFT backplanes
6.4. Smart systems
6.6. Solar cells
6.7. Smart textiles
6.10. Other applications
The more complex the printed electronic products are and the more sophisticated the production process is, the more important the related service industry becomes.
7.2. R&D funding management
7.3. R&D / Research & Development
7.6. Venture and equity capitalization
7.7. Professional and trade associations
7.8. Technical books, technical journals, technical publishers
7.9. Other services