Complete R2R manufacturing process for hybrid demonstrator
01.03.2023 von 18:00 - 19:30
Vortragsart: Poster Präsentation
Printing of conductive wiring and SMD component assembly on stretchable substrates have earlier demonstrated as pilot level R2R processes, but plastic foam lamination process as pilot level process has lacked. We have demonstrated full pilot level process using TPU substrate for R2R printing, assembly of SMD components and lamination of plastic foam planarization layer on top of electronics assembly.