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In Mold Electronics Process with Conductive Electroless Copper Traces

01.03.2023 von 16:20 - 16:40

ICM Saal 13b

Sprache: Englisch

Vortragsart: Oral Presentation


We will present a new process derived from the conventional IME. It makes it possible to obtain a conductive network based on electroless copper of resistivity much better than conventional silver inks. We will also show that this process makes it possible to replace conductive adhesives by soldering of electronic components directly on the host pads. A typical demonstrative vehicle will be detailed.