Novel ACF-products for room temperature, low pressure component bonding in flexible, hybrid and printed electronics are ready for the market.
01.03.2023 von 18:00 - 19:30
Vortragsart: Poster Präsentation
This new, anisotropic, conductive film (ACF) enables bonding of electronic components at room temperature and low pressure, addressing a key challenge; how to attach components to flexible substrates at room temperature.
The ACF needs no post-curing, and it has a low content of conductive particles, allowing for reduced cost and good adhesion.
The first product versions are ready for the market in Q1-’23.