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Printed circuit boards made of aluminum with directly solderable surface

01.03.2023 von 17:20 - 17:40

ICM Saal 13a

Sprache: Englisch

Vortragsart: Oral Presentation


A major barrier for using aluminum as a conductor trace material in printed circuit boards is the poor solderabily of aluminum surfaces. The paper presents the results of a new surface treatment technology which can produce an aluminum surface that can be soldered directly with standard solders an is in no way inferior to an LF-HAL surface on copper in terms of solder joint quality.