Auch für die LOPEC 2024 haben wir wieder namhafte Vertreter aus der Industrie und der Wissenschaft eingeladen, auf dem Kongress zu sprechen. Sie sind Experten aus der Elektronikindustrie, der Druck- und Verpackungsbranche, dem Automobilbau, oder der Informationstechnik. Sie kommen von renommierten Unternehmen, Universitäten und Forschungseinrichtungen aus der ganzen Welt.
Das gesamte Kongressprogramm wird voraussichtlich Anfang Dezember 2023 verfügbar sein.
Name | Firma |
---|---|
Karine Benbelaid | Covestro Deutschland AG (DE) |
Prof. Christoph J. Brabec | FAU Universität Erlangen (DE) |
Dr. YongAn Huang | Huazhong University of Science and Technology (CN) |
Dave Moore | PragmatIC Semi Ltd. (UK) |
Dr. Alain Schumacher | IEE S.A. (LU) |
Dr. Petra Severit | Altana AG (DE) |
Dr. Bernd Grimm | LIH - Luxembourg Institute of Health (LU) |
Dr. Hiroki Maeda | DNP - Dainippon Printing Co., Ltd. (JP) |
Session | Name | Firma |
---|---|---|
Business and product developments | Dr. Ashok Sridhar | TracXon B.V. (NL) |
End-user applications and requirements | Ville Vartiovaara | GE Healthcare Finland Oy (FI) |
Markets and business environment | Christian Stammel | Wearable Technologies AG |
Session | Name | Firma |
---|---|---|
Smart textiles and wearables | Linda van de Peppel | Holst Centre (NL) |
Biomedical and healthcare applications | Prof. Sabine Szunerits | University of Lille (FR) |
Smart and hybrid systems | Dr. Rudy Gosh | PulseForge Corporation (US) |
User interfaces, displays and lighting | Pierre-Alain Cotte | LivingPackets (FR) |
Circular economy and green electronics | Liisa Hakola | VTT - Technical Research Centre of Finland (FI) |
3D structural electronics | Dr. Tobias Stubhan | SCIPRIOS GmbH (DE) |
Functional material | Brian Bischoff | Copprium, Inc. (US) |
Substrates and encapsulation | Laurent Lenglet | CTP - Centre Technique du Papier (FR) |
Energy generation and storage | Dr. Matthias Meier-Grüll | Forschungszentrum Jülich (DE) |
Upscaling production and manufacturing processes | Mikko Paakkolanvaara | Screentec Oy (FI) |
Session | Name | Firma |
---|---|---|
Manufacturing and Deposition Techniques in flexible electronics | Dr. Jakob Heier | Empa -Swiss Federal Laboratories for Materials Science and Technology (CH) |
Advanced Printed Electronics systems for Sustainable Energy and Mobility | Prof. Chang-Qi Ma | Suzhou Institute of Nano-Tech and Nano-Bionics, SINANO (CN) |
Materials and Printing Technologies for Sustainable Electronics | Dr. Henning Richter | Nano-C, Inc. (US) |
Advancements in Printed Electronics Materials | Prof. Shlomo Magdassi | The Hebrew University of Jerusalem (IS) |
Session | Name | Company |
---|---|---|
OPV | Dr. Jan Birnstock | Heliatek GmbH (DE) |
Printed battery | Dr. Martin Krebs | Elmeric GmbH (DE) |
Process (KIT) 3D structure, sustainable process | Dr. Steffen Gerhard Scholz | Karlsruhe Institute of Technology, IAI (DE) |
Recycling, Sustainability, circularity | Dr. Lionel Tenchine | IPC - Innovation Plasturgie Composites (FR) |
Ink (solvant based Bio based) | Corinne Versini | GenesInk (FR) |
In Mold electronics | Dr. Paavo Niskala | TactoTek Oy (FI) |
Process control | Theresa Burke | IBS BV (NL) |
Sensors & Actuators/Textile displays | Pedro Magalhães | TINTEX Textiles SA (PT) |