Technical Conference

The Technical Conference provides status updates on the development of specific products and business sectors. It is industry and application oriented and promotes the ongoing development of products and business segments.

Technical Conference 2024 topics

Smart and hybrid systems

Technical challenges of combining film-based electronics with discrete components for IoT applications. Topics include printed electronic components and systems, including interconnection technologies and integration methods, hybrid integration and sensing, and applications.

User interfaces, displays and lighting

User interfaces

Recent advancements and use cases on how printed, hybrid and structural electronics enables unique touch, gesture and haptic trends in human-machine interactions by creating smart, interactive surfaces in applications like automotive, home appliance, medical and others.


Materials and technologies for emerging flexible display applications, including novel emitters (OLED, QDs, perovskites, microLEDs), novel manufacturing routes, additional in-display functionality, and integration challenges in IoT, smart phone displays, TV screens and automotive displays.


Technologies and applications of (flexible) large-area lighting. We encourage the submission of original papers on all aspects of OLED and microLED research, engineering, evaluation and integration for future lighting applications.

Smart textiles and wearables

Recent progress, challenges, advances and use cases in materials and integration of various functionalities in textiles and the application of printed and flexible electronics for implementing wearable sensors and actuators in smart garments and wearable devices. Topics include the interconnection between soft and hard components, the advantages of textiles over other media, and use cases in close-to-body scenarios.

Energy generation and storage

Technologies for energy production, harvesting and storage, including thin-film photovoltaics (Organic solar cells, perovskites, CIGS (copper indium gallium selenide) and DSSC (dye-sensitized solar cell), thermoelectrics, thin-film batteries and supercapacitors.

Upscaling production and manufacturing processes

Challenges and advances in upscaling production, additive (e.g. printing) and heterogeneous manufacturing processes, including materials & processing issues, manufacturing reliability, inspection and quality control in production lines.

Biomedical and healthcare applications

Challenges and use cases of large area, printed or organic electronics in biomedical applications. This includes all applications in biomedical and healthcare such as sensors, diagnostic devices and wearable health patches that contain significant printed and flexible elements.

Functional materials

The “functional materials” session covers any novel material that can be used to create flexible electronics and functional surface applications. This entails latest enabling material solutions applicable to multiple types of surfaces, which provide unique features to allow simple surfaces to become smart as well as latest materials that are used to create or protect the surface itself.

Substrates and encapsulation

Next Generation Flexible Substrates and Encapsulation Materials and Technologies.

Circular economy and green electronics

Printed electronics processes, materials or/and products which highlight the contribution of our industry to the challenges of circular economy or define milestones by new green products, system concepts and business models.

3D structural electronics

Integration of electronics and other multi-physical functions onto structural elements e.g. via 3D printing, laser structuring, in-molding, thermoforming, or 3D MID and its application in mobile electronics, automotive, aerospace, medical devices, sensors and connectors, household appliances, wearables and clothing.

Technical Conference Chair

Dr. Richard Price, PragmatIC Semiconductor Ltd. (UK), CTO

Poster Presentations

In addition to the oral presentations, we will also offer a poster exhibition. This means that instead of giving a presentation, you can display the essential information on an A0 poster on both days of the exhibition. During the Poster Session on Wednesday, March 6, 2024 from 18:00 to 19:30, you can communicate with the event participants personally and answer any questions on the spot.

Flexible and Printed Electronics™ Journal – Focus Collection

Furthermore, the LOPEC Scientific Board is collaborating with the academic journal Flexible and Printed Electronics™ by IOP, to publish a special Focus Collection of articles based on the research presented at LOPEC. This gives LOPEC presenters the unique opportunity to publish their research in a peer-reviewed journal. Submitted contributions must contain novel research and are not limited to results presented at the conference. All submitted articles will be peer-reviewed and must meet the high editorial standards of Flexible and Printed Electronics™.