Die Technical Conference der LOPEC

Technical challenges, innovative advanced materials, and use cases of combining printed and organic electronics with traditional silicon electronics and/or 3D structural elements. Topics include interconnection technologies, hybrid integration methods, 3D printing, laser structuring, in-molding, thermoforming, and applications of such systems.

Technical challenges, innovative advanced materials and use cases demonstrating how printed, hybrid, and structural electronics enable smart interactive surfaces for human-machine interaction (HMI). Topics include touch, gesture, and haptic sensing and feedback, flexible displays such as OLEDs, quantum dots QDs, perovskites, and microLEDs, as well as flexible large-area lighting applications, integration challenges, and applications of such systems.

Technical challenges, innovative advanced materials, and use cases for the integration of various functionalities into textiles, garments, wearables, health patches, and diagnostic devices. Topics include wearable sensors, actuators, close-to-body electronics, integration challenges such as soft-to-hard components, internet of wearable things (IoWT), and applications of such systems.

We are currently facing technical challenges, innovative advanced materials, and use cases for energy production, harvesting, and storage. The agenda includes a range of topics relevant to the field, such as thin-film photovoltaics (organic solar cells, perovskites, copper indium gallium selenide (CIGS), and dye-sensitized solar cells (DSSC)), along with thermoelectric and electrocaloric systems, thin-film batteries, and supercapacitors, along with their various applications.

The technical challenges we have encountered include the use of innovative advanced materials and the development of use cases for upscaling production. The topics include additive (e.g., printing) and heterogeneous manufacturing processes, automation, manufacturing reliability, inspection, quality control in production lines, and applications of such systems.

The subject of this investigation is technical challenges, innovative advanced materials, and use cases that are enhanced by advancements driven by artificial intelligence. The subject matter encompasses machine learning applications for smart materials, autonomous systems, design and development automation, performance prediction, process parameter optimization, energy efficiency, user interfaces, data management, multivariable data analysis, real-time detection, and auto-correction.

The following subjects will be discussed in this session: technical challenges, innovative advanced materials, and use cases of next-generation flexible substrates, functional surface applications, and encapsulation. The focus is on novel enabling material solutions for conductive, semiconductive and dielectric materials. Furthermore, the session will delve into the exploration of substrate materials and surface coatings for flexible substrates, with a focus on the delivery of protection, smoothness, electrical shielding, adhesion, optical properties, and effective moisture and oxygen barriers.

The technical challenges, innovative advanced materials, and use cases that highlight the contribution of organic and printed electronics to the challenges of circular economy, or that demonstrate milestones achieved through new green products, system concepts, and business models, are of particular interest.